Wearables, smart homes, smart cities and Industry 4.0 are driving varieties of applications and fueling today’s Internet of Things (IoT) market growth.

The fusion of IoT, artificial intelligence (AI) & 5G will expedite the evolution of connected devices to smart devices and unleash the power of data.

Fast growing IoT devices are driving the exponential growth of data that will be processed through AI to make devices smarter and enrich the user experiences. A wide range of edge IoT applications are on the horizon as 5G infrastructure enables massive machine-to-machine (M2M) networking, low latency communication and fast connection.

The increasing of IoT applications also create scenarios where edge devices and sensors will be powered by batteries, while battery life influences the usefulness and proliferation of IoT devices. TSMC innovative ultra-low power (ULP) technology is essential to extend battery life and enhance product performance.

TSMC provides a comprehensive IoT platform with ULP technologies to enable low-power and low-leakage applications.

TSMC ULP IoT Platform includes:

• Process technologies with proven manufacturing track record: 55nm ULP, 40nm ULP, 28nm ULP, 22nm ULP/Ultra-low leakage (ULL), and N12e™
• Low operating voltage (Low Vdd) technologies for extreme low power applications and to balance power and performance
• Ultra-low power technology platform including low Vdd solution, low leakage devices (eHVT & ULL SRAM), enhanced RF and analog, embedded non-volatile memory, CMOS image sensor, and MEMS
• Advanced wafer-level system integration (WLSI), including 3DIC
• A comprehensive IP ecosystem