Wearables (AR/VR smart glasses and smart watches), smart homes (smart appliances with edge artificial intelligence [AI] capability), smart cities, and Industrial Internet of Things (IoT) applications (like smart retail, energy monitoring, and manufacturing automation) drive the multiplicity of applications fueling IoT with high single-digit growth.
The fusion of IoT, AI, and 5G will expedite the evolution of connected devices to smart devices and unleash the power of data.
IoT devices are driving the exponential growth of data used by AI to make smarter devices and enrich user experiences. A wide range of edge IoT applications will be coming soon as 5G infrastructure enables more machine-to-machine (M2M) networking, low-latency communication, and fast connection.
The increasing of IoT applications will also create scenarios where edge devices and sensors will be powered by batteries, while, at the same time, improved battery life will influence the usefulness and proliferation of IoT devices.
TSMC provides a comprehensive IoT platform with Ultra-Low Power (ULP) technologies to enable low-power and low-leakage applications, which are essential to extend battery life and enhance product performance.
TSMC's ULP IoT Platform includes:
- Highly integrated ULP technology platforms: 55nm ULP, 40nm ULP, 28nm ULP, 22nm ULP, 22nm Ultra-Low Leakage (ULL), N12e®, N6e®, and N4e™ – all built on TSMC’s manufacturing-proven logic technologies from 55nm to 4nm
- Low operating voltage (low Vdd) technologies for extremely low-power applications and to balance power and performance
- Ultra-low power technologies, including low Vdd solutions, low leakage devices (eHVT and ULL SRAM), enhanced RF and analog, embedded non-volatile memory (eNVM), CMOS image sensor (CIS), and MEMS
- Advanced wafer-level system integration (WLSI), including 3DIC
- A comprehensive IP ecosystem
